Projects

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Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

60.60 Standard published

CLC/SR 47D

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

60.60 Standard published

CLC/SR 47D

Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST

60.60 Standard published

CLC/SR 47

Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave

60.60 Standard published

CLC/SR 47

Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET)

60.60 Standard published

CLC/SR 47

Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers

60.60 Standard published

CLC/SR 47

Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers

60.60 Standard published

CLC/SR 47

Semiconductor devices - Time Dependent Dielectric Breakdown (TDDB) test for gate dielectric films

60.60 Standard published

CLC/SR 47

Semiconductor devices - Constant current electromigration test

60.60 Standard published

CLC/SR 47

Semiconductor devices - Hot carrier test on MOS transistors

60.60 Standard published

CLC/SR 47

Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)

60.60 Standard published

CLC/SR 47

Semiconductor devices - Metallization stress void test

60.60 Standard published

CLC/SR 47

International Electrotechnical Vocabulary (IEV) - Part 521: Semiconductor devices and integrated circuits

60.60 Standard published

TC 1