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EN 62418:2010

Semiconductor devices - Metallization stress void test EN 62418:2010

Publication date:   Sep 16, 2010

General information

60.60   Standard published   Jul 9, 2010

CENELEC

CLC/TC 47X

European Norm

31.080   Semiconductor devices

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Scope

IEC 62418:2010 describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization.

Life cycle

NOW

PUBLISHED
EN 62418:2010
60.60 Standard published
Jul 9, 2010




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