IEC 61188-6-3:2024 specifies the requirements for lands and land pattern on circuit boards for the mounting of components with leads by soldering based on the solder joint requirements of IEC 61191-1 and IEC 61191-3.
This part of IEC 61188 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through hole mounted components. These requirements are based on the solder joint requirements of IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.
This first edition partially cancels and replaces the IEC 61188-5 series of International Standards.
The significant technical changes with respect to the previous edition are listed in the Introduction and further detailed information and calculations can be found in Annex A.
PUBLISHED
IEC 61188-5-2:2003 ED1
PUBLISHED
IEC 61188-5-6:2003 ED1
PUBLISHED
IEC 61188-5-8:2007 ED1
PUBLISHED
IEC 61188-5-3:2007 ED1
PUBLISHED
IEC 61188-5-4:2007 ED1
PUBLISHED
IEC 61188-5-5:2007 ED1
PUBLISHED
IEC 61188-6-3:2024 ED1
60.60
Standard published
Dec 9, 2024