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IEC 61188-5-2:2003 ED1

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components IEC 61188-5-2:2003 ED1

Publication date:   Jun 24, 2003

General information

60.60 Standard published   Jun 24, 2003

IEC

TC 91

International Standard

31.180   Printed circuits and boards | 31.190   Electronic component assemblies

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Scope

Provides information on land pattern geometries used for the surface attachment of discrete electronic components. Provides the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and rework of resulting solder joints.

Life cycle

NOW

PUBLISHED
IEC 61188-5-2:2003 ED1
60.60 Standard published
Jun 24, 2003

REVISED BY

PUBLISHED
IEC 61188-6-2:2021 ED1

PUBLISHED
IEC 61188-6-3:2024 ED1