31.180
Printed circuits and boards
| 31.190
Electronic component assemblies
Buying
Published
Scope
Provides information on land pattern geometries used for the surface attachment of discrete electronic components. Provides the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and rework of resulting solder joints.
Life cycle
NOW
PUBLISHED IEC 61188-5-2:2003 ED1 60.60
Standard published Jun 24, 2003