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IEC 61188-6-2:2021 ED1

Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) IEC 61188-6-2:2021 ED1

Publication date:   Feb 4, 2021

General information

60.60 Standard published   Feb 4, 2021

IEC

TC 91

International Standard

31.180   Printed circuits and boards | 31.190   Electronic component assemblies

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Scope

IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191‑2:2017.

Life cycle

PREVIOUSLY

PUBLISHED
IEC 61188-5-2:2003 ED1

PUBLISHED
IEC 61188-5-6:2003 ED1

PUBLISHED
IEC 61188-5-8:2007 ED1

PUBLISHED
IEC 61188-5-3:2007 ED1

PUBLISHED
IEC 61188-5-4:2007 ED1

PUBLISHED
IEC 61188-5-5:2007 ED1

NOW

PUBLISHED
IEC 61188-6-2:2021 ED1
60.60 Standard published
Feb 4, 2021