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IEC 61188-5-6:2003 ED1

Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides IEC 61188-5-6:2003 ED1

Publication date:   Jan 23, 2003

General information

60.60 Standard published   Jan 23, 2003

IEC

TC 91

International Standard

31.190   Electronic component assemblies

Buying

Published

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Scope

Provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. Provides the appropriate size, shape and tolerances of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and also allows for inspection, testing and reworking of resulting solder joints.

Life cycle

NOW

PUBLISHED
IEC 61188-5-6:2003 ED1
60.60 Standard published
Jan 23, 2003

REVISED BY

PUBLISHED
IEC 61188-6-2:2021 ED1

IN_DEVELOPMENT
IEC 61188-6-3 ED1