IEC 61188-6-3 ED1

Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) IEC 61188-6-3 ED1

Current stage: 40.99 Full report circulated: DIS approved for registration as FDIS May 10, 2024

Next stage: DECFDIS Next stage date : May 31, 2024

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.180 Printed circuits and boards | 31.190 Electronic component assemblies

IN_DEVELOPMENT
IEC 61188-6-3 ED1
40.99 Full report circulated: DIS approved for registration as FDIS
May 10, 2024