Main menu
Use the form below to find particular standards or projects. Enter your criteria for searching (single or in combination) in the fields below and press the button “Search”. You can also search using the Advance Search facility.
Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
60.60 Standard published
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
60.60 Standard published
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
60.60 Standard published
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
60.60 Standard published
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
60.60 Standard published
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
60.60 Standard published
Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock
60.60 Standard published
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
60.60 Standard published
Complete filter units for radio interference suppression - Part 2-1: Blank detail specification - Passive filter units for electromagnetic interference suppression - Filters for which safety tests are required (assessment level D/DZ)
60.60 Standard published
Complete filter units for radio interference suppression - Part 2-2: Blank detail specification - Passive filter units for electromagnetic interference suppression - Filters for which safety tests are required (safety tests only)
60.60 Standard published
Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
60.60 Standard published
Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
60.60 Standard published
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
60.60 Standard published
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
60.60 Standard published
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
60.60 Standard published
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
60.60 Standard published
Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
60.60 Standard published
Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
60.60 Standard published