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EN 60068-2-83:2011

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste EN 60068-2-83:2011

Publication date:   Dec 16, 2011

General information

60.60 Standard published   Oct 14, 2011

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

19.040   Environmental testing | 31.190   Electronic component assemblies

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Scope

IEC 60068-2-83:2011 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for pass - fail purposes. NOTE: Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting balance evaluation using solder bath and solder globule method.

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PUBLISHED
EN 60068-2-83:2011
60.60 Standard published
Oct 14, 2011

REVISED BY

IN_DEVELOPMENT
prEN IEC 60068-2-83