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EN 61188-5-2:2003

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components EN 61188-5-2:2003

Publication date:   Aug 10, 2006

General information

90.93   Standard confirmed   Jan 5, 2026

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.180   Printed circuits and boards | 31.190   Electronic component assemblies

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Scope

Provides information on land pattern geometries used for the surface attachment of discrete electronic components. Provides the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and rework of resulting solder joints.

Life cycle

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PUBLISHED
EN 61188-5-2:2003
90.93 Standard confirmed
Jan 5, 2026




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