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EN 61191-2:2017

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies EN 61191-2:2017

Publication date:   Mar 15, 2018

General information

60.60 Standard published   Oct 13, 2017

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.190   Electronic component assemblies | 31.240   Mechanical structures for electronic equipment

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Scope

IEC 61191-2:2017(E) gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.).

This edition includes the following significant technical changes with respect to the previous edition:

a)   the requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F;

b)   some of the terminology used in the document has been updated;

c)   references to IEC standards have been corrected;

d)   five termination styles have been added.

Life cycle

PREVIOUSLY

WITHDRAWN
EN 61191-2:2013

NOW

PUBLISHED
EN 61191-2:2017
60.60 Standard published
Oct 13, 2017

CORRIGENDA / AMENDMENTS

PUBLISHED
EN 61191-2:2017/AC:2019-10