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EN 61191-2:2013

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies EN 61191-2:2013

Publication date:   Dec 17, 2013

General information

99.60 Withdrawal effective   Oct 13, 2020

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.190   Electronic component assemblies | 31.240   Mechanical structures for electronic equipment

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Scope

IEC 61191-2:2013 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.). This edition includes the following significant technical changes with respect to the previous edition: - IPC-A-610 on workmanship has been included as a normative reference; - some of the terminology used in the document has been updated; - references to IEC standards have been corrected; - the use of lead-free solder paste and plating are addressed.

Life cycle

PREVIOUSLY

WITHDRAWN
EN 61191-2:1998

NOW

WITHDRAWN
EN 61191-2:2013
99.60 Withdrawal effective
Oct 13, 2020

REVISED BY

PUBLISHED
EN 61191-2:2017