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IEC 61188-5-8:2007 ED1

Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) IEC 61188-5-8:2007 ED1

Publication date:   Oct 30, 2007

General information

60.60 Standard published   Oct 30, 2007

IEC

TC 91

International Standard

31.180   Printed circuits and boards

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Published

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Scope

IEC 61188-5-8:2007 provides information on land pattern geometries used for the surface attachment of electronic components with area array terminations in the form of solder balls, solder columns or protective coated lands. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder joint, and also allow for inspection, testing and reworking of those solder joints.

This publication is to be read in conjunction with IEC 61188-5-1:2002.

Life cycle

NOW

PUBLISHED
IEC 61188-5-8:2007 ED1
60.60 Standard published
Oct 30, 2007

REVISED BY

PUBLISHED
IEC 61188-6-2:2021 ED1

IN_DEVELOPMENT
IEC 61188-6-3 ED1