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IEC 61188-5-4:2007 ED1

Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides IEC 61188-5-4:2007 ED1

Publication date:   Oct 30, 2007

General information

60.60 Standard published   Oct 30, 2007

IEC

TC 91

International Standard

31.180   Printed circuits and boards

Buying

Published

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Scope

IEC 61188-5-4:2007 provides the component and land pattern dimensions for small outline integrated circuits with "J" leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.

Life cycle

NOW

PUBLISHED
IEC 61188-5-4:2007 ED1
60.60 Standard published
Oct 30, 2007

REVISED BY

PUBLISHED
IEC 61188-6-2:2021 ED1

IN_DEVELOPMENT
IEC 61188-6-3 ED1