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Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices

60.60 Standard published

TC 47

Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)

60.60 Standard published

TC 47

Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage

60.60 Standard published

TC 47

Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices

60.60 Standard published

TC 47

Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test

60.60 Standard published

TC 47

Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature

60.60 Standard published

TC 47

Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases

60.60 Standard published

TC 47

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing

60.60 Standard published

TC 47

Corrigendum 2 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing

60.60 Standard published

TC 47

Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing

60.60 Standard published

TC 47

Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking

60.60 Standard published

TC 47

Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices

60.60 Standard published

TC 47

Semiconductor die products - Part 1: Procurement and use

60.60 Standard published

TC 47

Semiconductor die products - Part 2: Exchange data formats

60.60 Standard published

TC 47

Semiconductor die products - Part 5: Requirements for information concerning electrical simulation

60.60 Standard published

TC 47

Semiconductor die products - Part 6: Requirements for information concerning thermal simulation

60.60 Standard published

TC 47

Semiconductor devices - Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET) - Part 1: Fast BTI test for MOSFET

60.60 Standard published

TC 47

Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET)

60.60 Standard published

TC 47