IEC 62258-6:2006 ED1

Semiconductor die products - Part 6: Requirements for information concerning thermal simulation IEC 62258-6:2006 ED1

Publication date:   Aug 28, 2006

Scope

Determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. Intends to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2