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IEC 60749-8:2002 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing IEC 60749-8:2002 ED1

Publication date:   Aug 30, 2002

General information

60.60 Standard published   Aug 30, 2002

IEC

TC 47

International Standard

31.080.01   Semiconductor devices in general

Buying

Published

Language in which you want to receive the document.

Scope

Applicable to semiconductor devices (discrete devices and integrated circuits), it determines the leak rate of semiconductor devices.

The contents of the corrigenda of April 2003 and August 2003 have been included in this copy.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60749:1996 ED2

WITHDRAWN
IEC 60749:1996/AMD1:2000 ED2

WITHDRAWN
IEC 60749:1996/AMD2:2001 ED2

NOW

PUBLISHED
IEC 60749-8:2002 ED1
60.60 Standard published
Aug 30, 2002

CORRIGENDA / AMENDMENTS

PUBLISHED
IEC 60749-8:2002/COR1:2003 ED1

PUBLISHED
IEC 60749-8:2002/COR2:2003 ED1