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Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems

60.60 Standard published

CLC/SR 47F

Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions

60.60 Standard published

CLC/SR 47F

Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

60.60 Standard published

CLC/SR 47F

Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures

60.60 Standard published

CLC/SR 47F

Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials

60.60 Standard published

CLC/SR 47F

Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films – Wafer curvature and cantilever beam deflection methods

60.60 Standard published

CLC/SR 47F

Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films

60.60 Standard published

CLC/SR 47F

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials

60.60 Standard published

CLC/SR 47F

Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses

60.60 Standard published

CLC/SR 47F

Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes

60.60 Standard published

CLC/SR 47F

Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials

60.60 Standard published

CLC/SR 47F

Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials

60.60 Standard published

CLC/SR 47

Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area

60.60 Standard published

CLC/SR 47F

Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures

60.60 Standard published

CLC/SR 47F

Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing

60.60 Standard published

CLC/SR 47

Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS

60.60 Standard published

CLC/SR 47

Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches

60.60 Standard published

CLC/SR 47F

Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials

60.60 Standard published

CLC/SR 47F