EN 62047-14:2012

Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials EN 62047-14:2012

Publication date:   May 17, 2012

General information

60.60 Standard published   Apr 6, 2012

CENELEC

CLC/TC 47X

European Norm

31.080.99   Other semiconductor devices

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Scope

IEC 62047-14:2012 describes definitions and procedures for measuring the forming limit of metallic film materials with a thickness range from 0,5 μm to 300 μm. The metallic film materials described herein are typically used in electric components, MEMS and micro-devices. When metallic film materials used in MEMS (see 2.1.2 of IEC 62047-1:2005) are fabricated by a forming process such as imprinting, it is necessary to predict the material failure in order to increase the reliability of the components. Through this prediction, the effectiveness of manufacturing MEMS components by a forming process can also be improved, because the period of developing a product can be reduced and manufacturing costs can thus be decreased. This standard presents one of the prediction methods for material failure in imprinting process.

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PUBLISHED
EN 62047-14:2012
60.60 Standard published
Apr 6, 2012