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EN 62047-16:2015

Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films – Wafer curvature and cantilever beam deflection methods EN 62047-16:2015

Publication date:   Aug 17, 2015

General information

60.60 Standard published   Jul 10, 2015

CENELEC

CLC/TC 47X

European Norm

31.080.99   Other semiconductor devices

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IEC 62047-16:2015 specifies the test methods to measure the residual stresses of films with thickness in the range of 0,01 μ to 10 μ in MEMS structures fabricated by wafer curvature or cantilever beam deflection methods.

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PUBLISHED
EN 62047-16:2015
60.60 Standard published
Jul 10, 2015