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EN 62047-25:2016

Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area EN 62047-25:2016

Publication date:   Mar 16, 2017

General information

60.60   Standard published   Nov 18, 2016

CENELEC

CLC/TC 47X

European Norm

31.080.99   Other semiconductor devices

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Scope

IEC 62047-25:2016 specifies the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS). This document is applicable to the in-situ pull-press and shearing strength measurement of the micro bonding area fabricated by microelectronic technology process and other micromachining technology.

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PUBLISHED
EN 62047-25:2016
60.60 Standard published
Nov 18, 2016




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