0

EN 62047-18:2013

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials EN 62047-18:2013

Publication date:   Dec 17, 2013

General information

60.60 Standard published   Sep 27, 2013

CENELEC

CLC/TC 47X

European Norm

31.080.99   Other semiconductor devices

Buying

Published

Language in which you want to receive the document.

Scope

IEC 62047-18:2013 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 micrometre and 10 micrometre. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features.

Life cycle

NOW

PUBLISHED
EN 62047-18:2013
60.60 Standard published
Sep 27, 2013