0

EN 62047-18:2013

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials EN 62047-18:2013

Publication date:   Dec 17, 2013

General information

60.60   Standard published   Sep 27, 2013

CENELEC

CLC/TC 47X

European Norm

31.080.99   Other semiconductor devices

Buying

Published

Language in which you want to receive the document.

Scope

IEC 62047-18:2013 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 micrometre and 10 micrometre. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features.

Life cycle

NOW

PUBLISHED
EN 62047-18:2013
60.60 Standard published
Sep 27, 2013




Access Genorma App Everywhere

Get fast and easy access to top European and International standards (EN, ISO, IEC) via your mobile phone, tablet or the web.

Google Play App Store Web Version