Projects

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Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters - AC semiconductor controllers and contactors for non-motor loads

60.60 Standard published

CLC/TC 121A

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components

60.60 Standard published

CLC/SR 91

Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides

60.60 Standard published

CLC/SR 91

Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides

60.60 Standard published

CLC/SR 91

Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides

60.60 Standard published

CLC/SR 91

Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)

60.60 Standard published

CLC/SR 91

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction

60.60 Standard published

CLC/SR 91

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys

60.60 Standard published

CLC/SR 91

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 1: General test methods and methodology

60.60 Standard published

CLC/SR 91

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 1: General test methods and methodology

60.60 Standard published

CLC/SR 91

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

60.60 Standard published

CLC/SR 91

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)

60.60 Standard published

CLC/SR 91

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator

60.60 Standard published

CLC/SR 91

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

60.60 Standard published

CLC/SR 91

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

60.60 Standard published

CLC/SR 91

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies

60.60 Standard published

CLC/SR 91

Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies

60.60 Standard published

CLC/SR 91

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies

60.60 Standard published

CLC/SR 91