0

EN 61188-5-8:2008

Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) EN 61188-5-8:2008

Publication date:   May 22, 2008

General information

60.60 Standard published   Mar 21, 2008

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.180   Printed circuits and boards

Buying

Published

Language in which you want to receive the document.

Scope

Provides information on land pattern geometries used for the surface attachment of electronic components with area array terminations in the form of solder balls, solder columns or protective coated lands. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder joint, and also allow for inspection, testing and reworking of those solder joints.

Life cycle

NOW

PUBLISHED
EN 61188-5-8:2008
60.60 Standard published
Mar 21, 2008