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EN 61189-3-719:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling EN 61189-3-719:2016

Publication date:   Aug 16, 2016

General information

60.60 Standard published   Apr 8, 2016

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.180   Printed circuits and boards

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Scope

IEC 61189-3-719:2016 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.

Life cycle

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PUBLISHED
EN 61189-3-719:2016
60.60 Standard published
Apr 8, 2016