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EN 61189-3:2008

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) EN 61189-3:2008

Publication date:   Mar 28, 2008

General information

60.60 Standard published   Jan 8, 2008

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.180   Printed circuits and boards

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Scope

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. The major changes with regard to the previous edition concern the addition of 25 new test methods and the deletion of Annex B.

Life cycle

PREVIOUSLY

WITHDRAWN
EN 61189-3:1997

WITHDRAWN
EN 61189-3:1997/A1:1999

NOW

PUBLISHED
EN 61189-3:2008
60.60 Standard published
Jan 8, 2008