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EN 61189-3:1997

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) EN 61189-3:1997

Publication date:   Aug 10, 2006

General information

99.60 Withdrawal effective   Dec 1, 2010

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.180   Printed circuits and boards

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Scope

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers chemical, mechanical and electrical test methods.

Life cycle

NOW

WITHDRAWN
EN 61189-3:1997
99.60 Withdrawal effective
Dec 1, 2010

CORRIGENDA / AMENDMENTS

WITHDRAWN
EN 61189-3:1997/A1:1999

REVISED BY

PUBLISHED
EN 61189-3:2008