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Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
60.60 Standard published
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
60.60 Standard published
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
60.60 Standard published
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
60.60 Standard published
Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
60.60 Standard published
Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
60.60 Standard published
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
60.60 Standard published
Printed boards - Part 20: Printed circuit boards for high-brightness LEDs
60.60 Standard published
Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C
60.60 Standard published
Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
60.60 Standard published
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
60.60 Standard published
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
60.60 Standard published
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
60.60 Standard published
Device embedded substrate - Part 1-1: Generic specification - Test methods
60.60 Standard published
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
60.60 Standard published
Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
60.60 Standard published
