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IEC 62137-1-2:2007 ED1

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test IEC 62137-1-2:2007 ED1

Publication date:   Jul 25, 2007

General information

60.60 Standard published   Jul 25, 2007

IEC

TC 91

International Standard

31.190   Electronic component assemblies

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Scope

The test method described in IEC 62137-1-2:2007 is applicable to leadless surface mounting components and surface mounting connectors to which pull test is not applicable. It is not applicable to multi-lead components and gull-wing leads. The method is designed to test and evaluate the endurance of the solder joint between component terminals and lands on a substrate, by means of a shear type mechanical stress. This test is applicable to evaluate the effects of repeated temperature change on the strength of the solder joints between terminals and lands on a substrate.

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PUBLISHED
IEC 62137-1-2:2007 ED1
60.60 Standard published
Jul 25, 2007