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IEC 62137-1-4:2009 ED1

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test IEC 62137-1-4:2009 ED1

Publication date:   Jan 26, 2009

General information

60.60 Standard published   Jan 26, 2009

IEC

TC 91

International Standard

31.190   Electronic component assemblies

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Scope

The test method described in IEC 62137-1-4:2009 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of substrate. This test also evaluates the effects of repeated mechanical stress, such as key pushing in cell phones, the strength of the solder joint between component terminals and lands on a substrate.

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PUBLISHED
IEC 62137-1-4:2009 ED1
60.60 Standard published
Jan 26, 2009