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IEC 62326-4-1:1996 ED1

Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C IEC 62326-4-1:1996 ED1

Publication date:   Dec 19, 1996

General information

60.60 Standard published   Dec 19, 1996

IEC

TC 91

International Standard

31.180   Printed circuits and boards

Buying

Published

Language in which you want to receive the document.

Scope

Relates to rigid multilayer printed boards with interlayer
connections. Specifies the capability qualifying component, the
characteristics to be tested, the test methods and conditions to be
applied, and the requirements to be fulfilled for testing
capability for performance level A, B or C.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60326-6:1980 ED1

WITHDRAWN
IEC 60326-6:1980/AMD2:1990 ED1

WITHDRAWN
IEC 60326-6:1980/AMD1:1983 ED1

NOW

PUBLISHED
IEC 62326-4-1:1996 ED1
60.60 Standard published
Dec 19, 1996