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IEC 62878-1:2019 ED1

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates IEC 62878-1:2019 ED1

Publication date:   Oct 14, 2019

General information

60.60   Standard published   Oct 14, 2019

IEC

TC 91

International Standard

31.180   Printed circuits and boards | 31.190   Electronic component assemblies

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Scope

IEC 62878-1:2019 specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.

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PUBLISHED
IEC 62878-1:2019 ED1
60.60 Standard published
Oct 14, 2019




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