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IEC 62739-1:2013 ED1

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing IEC 62739-1:2013 ED1

Publication date:   Jun 18, 2013

General information

60.60   Standard published   Jun 18, 2013

IEC

TC 91

International Standard

31.190   Electronic component assemblies | 31.240   Mechanical structures for electronic equipment

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Scope

IEC 62739-1:2013 provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.

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PUBLISHED
IEC 62739-1:2013 ED1
60.60 Standard published
Jun 18, 2013




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