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Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
60.60 Standard published
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
60.60 Standard published
Thermal standardization on semiconductor packages - Part 2: 3D thermal simulation models of discrete semiconductor packages for steady-state analysis
40.99 Full report circulated: DIS approved for registration as FDIS
Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis
40.20 DIS ballot initiated: 12 weeks
Thermal standardization on semiconductor packages - Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points
30.20 CD study/ballot initiated
Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
60.60 Standard published
Required Specification Of Package Substrates For Advanced Semiconductor Packaging - Part 1: Current-Induced Quality Test Method for Package Substrate
10.60 Close of voting
3D thermal simulation models of PBGA and FBGA packages for steady-state analysis
10.20 New project ballot initiated
Thermal standardization on semiconductor packages - Part 4: Thermal evaluation board specifications for fine pitch semiconductor packages
10.20 New project ballot initiated
Model creation method using a datasheet of semiconductor device
10.20 New project ballot initiated
Part model guideline for electronic-device packages - XML requirements
10.60 Close of voting
IEC60191-6-23 Ed.1.0 :Standardization roadmap for fan-out packages
00.99 Approval to ballot proposal for new project
Model creation method using a measurement data of semiconductor device
00.00 Proposal for new project received
IEC 6xxxxx-2: Required Specifications of package substrates for advanced semiconductor packaging - Part 2 Failure Analysis Methods for Current Induced Quality Test of Package Substrates
00.00 Proposal for new project received
IEC 6xxxxx-3: Required Specifications of package substrates for advanced semiconductor packaging - Part 3 Standard Substrates structure for Current Induced Quality Test of Package Substrates
00.00 Proposal for new project received
Thermal standardization on semiconductor packages – Part 7: Background and glossary of Thermal Simulation and Compact Thermal Models on Semiconductor Packaging
00.00 Proposal for new project received
Future IEC TR 60191-7-2 Ed.1: Thermal conductivity measurement method and samples for electronic components
00.00 Proposal for new project received