PWI 47D-12

IEC 6xxxxx-2: Required Specifications of package substrates for advanced semiconductor packaging - Part 2 Failure Analysis Methods for Current Induced Quality Test of Package Substrates PWI 47D-12

General information

Current stage: 00.00 Proposal for new project received Feb 2, 2024

Next stage: PREPNW Next stage date : Feb 28, 2029

Originator: IEC

Owner: TC 47/SC 47D

Type: International Standard

Life cycle

NOW

IN_DEVELOPMENT
PWI 47D-12
00.00 Proposal for new project received
Feb 2, 2024