PWI 47D-13

IEC 6xxxxx-3: Required Specifications of package substrates for advanced semiconductor packaging - Part 3 Standard Substrates structure for Current Induced Quality Test of Package Substrates PWI 47D-13

General information

Current stage: 00.00 Proposal for new project received Feb 2, 2024

Next stage: PREPNW Next stage date : Feb 28, 2030

Originator: IEC

Owner: TC 47/SC 47D

Type: International Standard

Life cycle

NOW

IN_DEVELOPMENT
PWI 47D-13
00.00 Proposal for new project received
Feb 2, 2024

Access Genorma App Everywhere

Get fast and easy access to top European and International standards (EN, ISO, IEC) via your mobile phone, tablet or the web.

Google Play App Store Web Version