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PWI 47D-8 ED1

Thermal standardization on semiconductor packages – Part 7: Background and glossary of Thermal Simulation and Compact Thermal Models on Semiconductor Packaging PWI 47D-8 ED1

General information

00.00 Proposal for new project received   Jan 13, 2023

PREPNW    Jan 12, 2024

IEC

TC 47/SC 47D

International Standard

Life cycle

NOW

IN_DEVELOPMENT
PWI 47D-8 ED1
00.00 Proposal for new project received
Jan 13, 2023