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PNW 47D-963 ED1

Required Specification Of Package Substrates For Advanced Semiconductor Packaging - Part 1: Current-Induced Quality Test Method for Package Substrate PNW 47D-963 ED1

General information

10.60 Close of voting   May 3, 2024

IEC

TC 47/SC 47D

International Standard

Life cycle

NOW

IN_DEVELOPMENT
PNW 47D-963 ED1
10.60 Close of voting
May 3, 2024