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PNW 47D-965 ED1

Thermal standardization on semiconductor packages - Part 4: Thermal evaluation board specifications for fine pitch semiconductor packages PNW 47D-965 ED1

General information

10.60 Close of voting   May 17, 2024

IEC

TC 47/SC 47D

International Standard

Life cycle

NOW

IN_DEVELOPMENT
PNW 47D-965 ED1
10.60 Close of voting
May 17, 2024