IEC 63378-2-1:2024 ED1

Thermal standardization on semiconductor packages - Part 2-1: 3D thermal simulation models of semiconductor packages for steady-state analysis - Discrete packages IEC 63378-2-1:2024 ED1

Publication date:   Oct 22, 2024

General information

60.60 Standard published   Oct 22, 2024

IEC

TC 47/SC 47D

International Standard

31.080.01   Semiconductor devices in general

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Scope

IEC 63378-2-1:2024 specifies three-dimensional (3D) thermal models of discrete semiconductor packages (TO-243, TO-252 and TO-263), utilized in the steady-state thermal analysis of electronic devices to estimate junction temperatures accurately.
This model is assumed to be made by semiconductor suppliers and to be used by assembly makers of electronic devices.

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PUBLISHED
IEC 63378-2-1:2024 ED1
60.60 Standard published
Oct 22, 2024