60.60 Standard published Oct 22, 2024
IEC
International Standard
31.080.01 Semiconductor devices in general
Published
IEC 63378-2-1:2024 specifies three-dimensional (3D) thermal models of discrete semiconductor packages (TO-243, TO-252 and TO-263), utilized in the steady-state thermal analysis of electronic devices to estimate junction temperatures accurately.
This model is assumed to be made by semiconductor suppliers and to be used by assembly makers of electronic devices.
PUBLISHED
IEC 63378-2-1:2024 ED1
60.60
Standard published
Oct 22, 2024