Projects

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Semiconductor devices - Micro-electromechanical devices - Part 46: Silicon based MEMS fabrication technology – Measurement method of tensile strength of nanoscale membrane

40.99 Full report circulated: DIS approved for registration as FDIS

TC 47/SC 47F

Semiconductor devices - Micro-electromechanical devices - Part 47: Silicon based MEMS fabrication technology - Measurement method of bending strength of microstructures

40.99 Full report circulated: DIS approved for registration as FDIS

TC 47/SC 47F

Semiconductor devices – Micro-electromechanical devices - Part 48: Test method of determining solution concentration by optical absorption using MEMS fluidic device

50.00 Final text received or FDIS registered for formal approval

TC 47/SC 47F

Semiconductor devices - Micro-electromechanical devices - Part 49: Reliability test methods of electro-mechanical conversion characteristics of piezoelectric MEMS cantilever

30.20 CD study/ballot initiated

TC 47/SC 47F

Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS

30.99 CD approved for registration as DIS

TC 47/SC 47F

Semiconductor devices - Micro-electromechanical devices - Part 50: MEMS capacitive silicon microphone

20.99 WD approved for registration as CD

TC 47/SC 47F

Semiconductor Devices - Micro-electromechanical Devices - Part 51: Test method of electrical characteristics under two-directional cyclic bending deformation for flexible micro-electromechanical devices

20.99 WD approved for registration as CD

TC 47/SC 47F

Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches

60.60 Standard published

TC 47/SC 47F

Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches

60.60 Standard published

TC 47/SC 47F

Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials

60.60 Standard published

TC 47/SC 47F

Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection

60.60 Standard published

TC 47/SC 47F

Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films

60.60 Standard published

TC 47/SC 47F

Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS

60.60 Standard published

TC 47/SC 47F

Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS

60.60 Standard published

TC 47/SC 47F

Semiconductor Devices - Micro-electromechanical Devices - Part 52: Biaxial tensile testing method for stretchable MEMS

10.20 New project ballot initiated

TC 47/SC 47F

Semiconductor devices - Micro-electromechanical devices - Part 53: MEMS electrothermal transfer device

10.20 New project ballot initiated

TC 47/SC 47F