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Semiconductor devices - Micro-electromechanical devices - Part 46: Silicon based MEMS fabrication technology - Measurement method of tensile strength of nanoscale thickness membrane
50.00 Final text received or FDIS registered for formal approval
Semiconductor devices - Micro-electromechanical devices - Part 47: Silicon based MEMS fabrication technology - Measurement method of bending strength of microstructures
50.00 Final text received or FDIS registered for formal approval
Semiconductor devices - Micro-electromechanical devices - Part 48: Test method for determining solution concentration by optical absorption using MEMS fluidic device
60.00 Standard under publication
Semiconductor devices - Micro-electromechanical devices - Part 49: Reliability test methods of electro-mechanical conversion characteristics of piezoelectric MEMS cantilever
30.99 CD approved for registration as DIS
Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
30.99 CD approved for registration as DIS
Semiconductor devices - Micro-electromechanical devices - Part 50: MEMS capacitive microphone
30.20 CD study/ballot initiated
Semiconductor Devices - Micro-electromechanical Devices - Part 51: Test method of electrical characteristics under two-directional cyclic bending deformation for flexible micro-electromechanical devices
20.99 WD approved for registration as CD
Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
60.60 Standard published
Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
60.60 Standard published
Semiconductor Devices - Micro-electromechanical Devices - Part 52: Biaxial tensile testing method for stretchable MEMS
20.99 WD approved for registration as CD
Semiconductor devices - Micro-electromechanical devices - Part 53: MEMS electrothermal transfer device
20.99 WD approved for registration as CD
Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
60.60 Standard published
Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
60.60 Standard published
Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
60.60 Standard published
Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
60.60 Standard published
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
60.60 Standard published
Micro-electromechanical devices - Part 54: Silicon based MEMS fabrication technology - Test method of microstructure tensile
10.20 New project ballot initiated
Micro-electromechanical devices - Part 55: Silicon based MEMS fabrication technology - Test method of microstructure pendulum impact
10.20 New project ballot initiated