60.60 Standard published Oct 17, 2003
CENELEC
European Norm
31.080.01 Semiconductor devices in general
Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.
PUBLISHED
EN 60749-14:2003
60.60
Standard published
Oct 17, 2003