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EN 60749-14:2003

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) EN 60749-14:2003

Publication date:   Aug 10, 2006

General information

60.60   Standard published   Oct 17, 2003

CENELEC

CLC/TC 47X

European Norm

31.080.01   Semiconductor devices in general

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Scope

Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

Life cycle

PREVIOUSLY

WITHDRAWN
EN 60749:1999/A2:2001

WITHDRAWN
EN 60749:1999/A1:2000

WITHDRAWN
EN 60749:1999

NOW

PUBLISHED
EN 60749-14:2003
60.60 Standard published
Oct 17, 2003




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