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Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads

60.60 Standard published

TC 91

Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

60.60 Standard published

TC 91

Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

60.60 Standard published

TC 91

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

60.60 Standard published

TC 91

Amendment 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

60.60 Standard published

TC 91

Corrigendum 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement)

60.60 Standard published

TC 91

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

60.60 Standard published

TC 91

Environmental testing - Part 2-82: Tests - Test Xw1: Whisker test methods for components and parts used in electronic assemblies

60.60 Standard published

TC 91

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

60.60 Standard published

TC 91

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

40.00 DIS registered

TC 91

ENVIRONMENTAL TESTING - Part 2-88: Tests – Test XD: Resistance of components and assemblies to liquid cleaning media

40.00 DIS registered

TC 91

Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering

60.60 Standard published

TC 91

Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies

60.60 Standard published

TC 91

Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies

60.60 Standard published

TC 91

Electronic assembly, design and circuit boards - Vocabulary - Part 2: Common usage in electronic technologies as well as electronic assembly technologies

40.99 Full report circulated: DIS approved for registration as FDIS

TC 91

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components

60.60 Standard published

TC 91

Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides

60.60 Standard published

TC 91

Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides

60.60 Standard published

TC 91