IEC 60068-2-83 ED2

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste IEC 60068-2-83 ED2

Current stage: 40.99 Full report circulated: DIS approved for registration as FDIS Dec 20, 2024

Next stage: DECFDIS Next stage date : Jan 31, 2025

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 19.040 Environmental testing | 31.190 Electronic component assemblies

IN_DEVELOPMENT
IEC 60068-2-83 ED2
40.99 Full report circulated: DIS approved for registration as FDIS
Dec 20, 2024