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IEC 60068-2-83 ED2

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste IEC 60068-2-83 ED2

General information

30.99 CD approved for registration as DIS   Feb 23, 2024

TCDV    Apr 30, 2024

IEC

TC 91

International Standard

19.040   Environmental testing | 31.190   Electronic component assemblies

Life cycle

PREVIOUSLY

PUBLISHED
IEC 60068-2-83:2011 ED1

NOW

IN_DEVELOPMENT
IEC 60068-2-83 ED2
30.99 CD approved for registration as DIS
Feb 23, 2024