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IEC 60068-2-58:2015/AMD1:2017 ED4

Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) IEC 60068-2-58:2015/AMD1:2017 ED4

Publication date:   Jul 28, 2017

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60.60 Standard published   Jul 28, 2017

IEC

TC 91

International Standard

19.040   Environmental testing | 31.190   Electronic component assemblies

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IEC 60068-2-58:2015 ED4

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IEC 60068-2-58:2015/AMD1:2017 ED4
60.60 Standard published
Jul 28, 2017