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IEC 60068-2-69:2017/AMD1:2019 ED3

Amendment 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method IEC 60068-2-69:2017/AMD1:2019 ED3

Publication date:   Jun 19, 2019

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60.60 Standard published   Jun 19, 2019

IEC

TC 91

International Standard

19.040   Environmental testing | 31.190   Electronic component assemblies

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IEC 60068-2-69:2017 ED3

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IEC 60068-2-69:2017/AMD1:2019 ED3
60.60 Standard published
Jun 19, 2019