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Device embedded substrate - Part 2-3: Guidelines - Design guide
60.60 Standard published
Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)
60.60 Standard published
Endurance test methods for die attach materials - Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices
60.60 Standard published
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
40.20 DIS ballot initiated: 12 weeks
ENVIRONMENTAL TESTING - Part 2-88: Tests – Test XD: Resistance of components and assemblies to liquid cleaning media
40.20 DIS ballot initiated: 12 weeks
Electronic assembly, design and circuit boards - Vocabulary - Part 2: Common usage in electronic technologies as well as electronic assembly technologies
50.00 Final text received or FDIS registered for formal approval
Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)
50.20 Proof sent to secretariat or FDIS ballot initiated: 8 weeks
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices ED2
20.99 WD approved for registration as CD
Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity
40.99 Full report circulated: DIS approved for registration as FDIS
Endurance test methods for die attach materials – Part 1: General specification
20.99 WD approved for registration as CD
Endurance test methods for die attach materials – Part 3: Power cycling test method for die attach materials applied to discrete type power electronic devices
30.60 Close of voting/ comment period
Endurance test methods for die attach materials – Part 5: Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices
40.60 Close of voting
