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IEC TR 61760-5-1:2024 ED1

Surface mounting technology - Part 5-1: Surface strain on circuit boards - Strain gauge measurement applied to chip components IEC TR 61760-5-1:2024 ED1

Publication date:   Jan 31, 2024

General information

60.60 Standard published   Jan 31, 2024

IEC

TC 91

Technical Report

31.190   Electronic component assemblies

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Scope

IEC TR 61760-5-1:2024 describes examples of methods using electrical strain gauges for determination of critical mechanical stresses in assembly processes. These stresses can damage chip type ceramic components, causing so called “bending cracks”. Area-array components are excluded from the scope of this document.

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PUBLISHED
IEC TR 61760-5-1:2024 ED1
60.60 Standard published
Jan 31, 2024