IEC TR 61760-5-1:2024 ED1

Name: IEC TR 61760-5-1:2024 ED1
Brand: IEC
SKU: IEC TR 61760-5-1:2024 ED1
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Surface mounting technology - Part 5-1: Surface strain on circuit boards - Strain gauge measurement applied to chip components IEC TR 61760-5-1:2024 ED1

Publication date: Jan 31, 2024

General information

Current stage: 60.60 Standard published Jan 31, 2024

Originator: IEC

Owner: TC 91

Type: Technical Report

ICS: 31.190 Electronic component assemblies

Buying

Status: Published

Scope

IEC TR 61760-5-1:2024 describes examples of methods using electrical strain gauges for determination of critical mechanical stresses in assembly processes. These stresses can damage chip type ceramic components, causing so called “bending cracks”. Area-array components are excluded from the scope of this document.

Life cycle

NOW

PUBLISHED
IEC TR 61760-5-1:2024 ED1
60.60 Standard published
Jan 31, 2024