0

IEC TR 62878-2-9:2022 ED1

Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industries IEC TR 62878-2-9:2022 ED1

Publication date:   Apr 27, 2022

General information

60.60 Standard published   Apr 27, 2022

IEC

TC 91

Technical Report

31.180   Printed circuits and boards | 31.190   Electronic component assemblies

Buying

Published

Language in which you want to receive the document.

Scope

IEC TR 62878-2-9:2022(E) comprises the long-term discussion among Jisso International Council (JIC) members during 1999 and 2005, when the interim agreement among all JIC members about the “concept of Jisso” as well as the “Jisso product level” for the common understanding on IEC TC 91 (electronic assembly technology) activities was reached. Further discussion on “Jisso Product Level” could be needed among the current JIC members to finalize it in the near future based on this technical report.

Life cycle

NOW

PUBLISHED
IEC TR 62878-2-9:2022 ED1
60.60 Standard published
Apr 27, 2022